this post was submitted on 03 Nov 2024
272 points (98.9% liked)
Technology
59468 readers
4432 users here now
This is a most excellent place for technology news and articles.
Our Rules
- Follow the lemmy.world rules.
- Only tech related content.
- Be excellent to each another!
- Mod approved content bots can post up to 10 articles per day.
- Threads asking for personal tech support may be deleted.
- Politics threads may be removed.
- No memes allowed as posts, OK to post as comments.
- Only approved bots from the list below, to ask if your bot can be added please contact us.
- Check for duplicates before posting, duplicates may be removed
Approved Bots
founded 1 year ago
MODERATORS
you are viewing a single comment's thread
view the rest of the comments
view the rest of the comments
The transfer speed isn't the big issue, it's the density and reliability. Packing more heat generating stuff onto the SoC package just makes it more difficult to dissipate. The transfer of data to where it needs to be is still the same, so the trade-off is pretty null in that sense except reduction of overall power consumption.