this post was submitted on 04 Oct 2024
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190
TSMC's 2nm process will reportedly get another price hike — $30,000 per wafer for latest cutting-edge tech (www.tomshardware.com)
submitted 1 month ago by [email protected] to c/[email protected]
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cross-posted from: https://sopuli.xyz/post/17702354

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[–] [email protected] 1 points 1 month ago

Absolutely. 3D stacking is becoming viable too, as AMD has proven with their X3D chips with massive gobs of L3 cache stacked on top of the logic dies. Vertical stacking and sheer die size is going to make total power density only continue to go up.